The package power can also be read from an MSR. It's not clear exactly
what is included, and whether it's aggregated over all nodes or
reported separately.

It does look like this is reported separately per CCX (I get a single
value on the Ryzen R7 1700), but it might be reported separately per-
die (node?) on larger processors. If that's the case, it would have to
be recorded per node and aggregated for the socket.

Note that although Zen has these MSRs reporting power, it looks like
the actual RAPL configuration (power limits, configured TDP) is done
through PCI configuration space. I have not yet found any public
documentation for this.

Signed-off-by: Calvin Walton <calvin.walton@kepstin.ca>
Signed-off-by: Len Brown <len.brown@intel.com>